Heat Sinks

Heat sinks are an electronic component that is used to manage heat generated by other electronic components, usually processors, keeping them within safe temperature limits. Heat sinks typically come in two forms: active and passive. Active heat sinks are typically comprised of a cooling fan attached to an aluminum alloy metal body. The metal body absorbs and removes heat from the processor, and the fan dissipates the heat away from the processor. Passive heat sinks are made from metal, and their design maximizes the surface area for heat dissipation. The metal body of a passive heat sink also absorbs and removes heat from the processor, however, the heat is dissipated into the surrounding environment. Heat sinks are used to increase the performance and lifetime of electronic components.
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(Ex. GST)(▲▼)		Enter Qty ProductMounting StyleHeatsink MaterialFin StyleThermal ResistanceLengthWidthHeightDesigned for
  
             
SK 564 100 SA


Heatsink: extruded; grilled; black; L:100mm; W:37mm; H:10mm
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Fisher 19
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AUD 6.2067
Multiples of: 1

     100 mm37 mm10 mm 
SK57725SA


Heatsink; LED; Ø:50mm; H:25mm; Colour: black
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Fisher 19
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AUD 7.0467
Multiples of: 1

       25 mm 
SKV585811-AL


Heat Sinks BGA Heatsink Aluminum 57.9x59x11mm Top Mount Plastic Push Pin Square Fins 8.40Degree CelsiusW Thermal Resistance
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Wakefield 19
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AUD 12.595
Multiples of: 1

Heat SinksPanelAluminumStraight Fin7.7 C/W59 mm57.91 mm11 mmBga
ATS-EXL58-300-R0


Heat Sinks Extrusion Profile, AL6063, Length 300mm, Width 6mm, Height 8mm
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Advanced Thermal Solutions 19
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AUD 13.1267
Multiples of: 1

Extrusions-AluminumExtruded Radial Fin45 C/W300 mm6 mm8 mm 
SK56950SA


Heatsink; LED; Ø:60mm; H:50mm; Colour: black
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Fisher 19
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AUD 14.6518
Multiples of: 1

       50 mm 
ATS-54325W-C1-R0


Heat Sinks High Performance Extrusion, Double-Sided Thermal Tape, Black-Anodized
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Advanced Thermal Solutions 19
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AUD 16.445
Multiples of: 1

Heat SinksAdhesiveAluminumStraight Fin3.1 C/W32.5 mm32.5 mm24.5 mmBGA
ATS-51425R-C1-R0


Heat Sinks maxiFLOW BGA Heatsink with maxiGRIP Attachment, Low Profile, T412, 42.5x42.5x19.5mm, 72.9mm Fin Tip
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Advanced Thermal Solutions 19
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AUD 24.3756
Multiples of: 1

Heat Sink AssembliesSnap OnAluminumAngled Fin1.86 C/W42.5 mm42.5 mm19.5 mmBGA
431K


Heat Sinks High Performance Heat Sink for 30-100W Metal Power Semis, 120.7x76.2x76.2mm
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Wakefield 19
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AUD 32.271
Multiples of: 1

Heat SinksScrewAluminumAngled Fin0.4 C/W76.2 mm120.7 mm76.2 mmPower Semiconductors
ATS-X53170P-C1-R0


Heat Sinks superGRIP HS Assembly-SF-STD
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Advanced Thermal Solutions 19
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AUD 33.3273
Multiples of: 1

        Bga
SMX8-X/i-HSP-B


Heat Sinks Heat spreader solution for SMARC module conga-SMX8-X with lidded NXP i.MX 8X ARM processor. All standoffs are with 2.7mm bore hole.
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Congatec 19
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AUD 41.25
Multiples of: 1

Heat Spreaders       SMARC Module
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