Multichip Packages

A multichip package is an integrated circuit package which contains multiple semiconductor dice. It is typically used for higher performance and for enhanced thermal, mechanical, and electrical properties. The multiple dies in a multichip package are connected by Wire bonds, Tape Automated Bonding (TAB), or Flip chip technology. Multichip package can be used to build more powerful and complex integrated circuits. Multichip packages are used in RF Applications, High-performance processors, Memories and ASICs. Multichip package helps in providing better electrical and thermal performance, higher reliability and reliability in a smaller package size.

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Image  Information Image Stock Code(▲▼)Description
Manufacturer
Availability ⓘ (▲▼)Price(AUD

(Ex. GST)(▲▼)
Enter Qty TypeMemory SizePackage / CaseSeriesMounting StyleMaximum Clock FrequencyMinimum Operating TemperatureMaximum Operating Temperature
  
            
XT61M2G8C2TM-B8BEA


NAND MCP BGA-162(10.5x8) Memory - Serial MCP (Multi Chip Package) ROHS
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This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.

XTX 4
Ships to you
between Fri. 09 Oct to Wed. 14 Oct
Calender.png

AUD 41.4828

Multiples of: 1

NAND MCP       
W71NW11GC1HW


Multichip Packages 1G-bit 1.8V NAND + 512Mb LPDDR1 MCP x16/x32
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This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.

Winbond 0
6 to 16 Weeks Calender.png

AUD 10.3462

Multiples of: 136

NAND Flash, LPDDR11 Gbit , 512 Mbit W71NW11GCSMD/SMT29 MHz , 200 MHz- 40 C+ 85 C
W71NW11HC1DW


Multichip Packages 1G-bit 1.8V NAND + 512Mb LPDDR1 MCP x16/x16
Icon ROHS
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.

Winbond 0
6 to 16 Weeks Calender.png

AUD 10.3462

Multiples of: 2500

NAND Flash, LPDDR11 Gbit , 512 Mbit W71NW11HCSMD/SMT29 MHz , 200 MHz- 40 C+ 85 C
W25M512JWBIQ TR


Multichip Packages spiFlash, 1.8V, 512M-bit, 4Kb Uniform Sector, DTR
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This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.

Winbond 0
6 to 16 Weeks Calender.png

AUD 10.5962

Multiples of: 2000

Serial NOR Flash512 MbitTFBGA - 24W25M512JWSMD/SMT104 MHz- 40 C+ 85 C
W71NW20GD3DW


Multichip Packages 2G-bit 1.8V NAND + 1G-bit LPDDR1 MCP x8/x32
Icon ROHS
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.

Winbond 0
6 to 16 Weeks Calender.png

AUD 10.642

Multiples of: 1

NAND Flash, LPDDR12 Gbit , 1 Gbit W71NW20GDSMD/SMT40 MHz , 200 MHz- 40 C+ 85 C
H26M41204HPR


FBGA-153 Memory - Serial MCP (Multi Chip Package) ROHS
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This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.

SK HYNIX 0
6 to 16 Weeks Calender.png

AUD 10.6723

Multiples of: 1

        
W71NW10GE3FW


Multichip Packages 1G-bit 1.8V NAND + 512Mb LPDDR2 MCP x8/x32
Icon ROHS
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.

Winbond 0
6 to 16 Weeks Calender.png

AUD 11.0769

Multiples of: 2000

NAND Flash, LPDDR21 Gbit , 512 Mbit W71NW10GESMD/SMT29 MHz , 400 MHz- 40 C+ 85 C
K4F8E304HB-MGCJT


FBGA Memory - Serial MCP (Multi Chip Package) ROHS
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This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.

SAMSUNG 0
6 to 16 Weeks Calender.png

AUD 11.2421

Multiples of: 1

        
MT29C4G48MAZBBAKS-48 IT


LPDDR DRAM CHIP, DRAM DENSITY 2GB, VOLTAGE 1.7V -1.9V
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This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.

Micron 0
6 to 16 Weeks Calender.png

AUD 11.3351

Multiples of: 1

NAND Flash, Mobile LPDDR14 Gbit , 2 GbitVFBGA - 137MT29CSMD/SMT208 MHz- 40 C+ 85 C
W71NW20GF3FW


Multichip Packages 2G-bit 1.8V NAND + 1G-bit LPDDR2 MCP x8/x32
Icon ROHS
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.

Winbond 0
6 to 16 Weeks Calender.png

AUD 11.61

Multiples of: 1

NAND Flash, LPDDR22 Gbit , 1 Gbit W71NW20GFSMD/SMT40 MHz , 533 MHz- 40 C+ 85 C
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